Power module, power converter device, and electrically powered vehicle

ABSTRACT

A power converter device includes a double-sided electrode module that converts direct current power to alternating current power, a heat dissipating base, a capacitor module, a positive electrode conductor plate, and a negative electrode conductor plate. In the heat dissipating base, heat dissipation surfaces, facing one another, of the double-sided electrode module facing to one another are held with insulation layers being present between the heat dissipating base, and the heat dissipation surfaces. The capacitor module constitutes a smoothing circuit for inhibiting fluctuation in DC voltage. The positive electrode conductor plate and the negative electrode conductor plate transmit electric power between the capacitor module and the double-sided electrode module.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.14/574,086, filed on Dec. 17, 2014, which is a continuation of U.S.application Ser. No. 12/920,296, filed Aug. 30, 2010, which is aNational Stage of PCT/JP2009/068704, filed Oct. 30, 2009, which claimspriority from Japanese Patent Application No. 2008-280682, filed on Oct.31, 2008, the disclosures of which are expressly incorporated byreference herein.

TECHNICAL FIELD

The present invention relates to a power module that converts betweendirect current power and alternating current power, a power converterdevice that includes the power module, and an electrically poweredvehicle that includes the power converter device.

BACKGROUND ART

A conventional power converter device has a power module that includespower semiconductors and converts between DC power and AC power by aswitching operation of the power semiconductors. The power modulefurther includes a base plate for heat dissipation, on which the powersemiconductors are arranged. Heat generated by the power semiconductorsis released to the base plate described earlier through a main surfaceon one side of the power semiconductors. On the base plate describedearlier, in addition, fins are formed on a surface of the other side ofthe side where the power semiconductors are arranged, and a coolingmedium contacts directly with the fins.

This kind of a power converter device is disclosed in Patent ReferenceLiterature 1 for instance.

However, further improvement in cooling performance requires expansionin the heat dissipation area of the power semiconductors. Expansion inthe heat dissipation area of the power semiconductors causes the powermodule structure to become complicated and leads to reduced productivityof the power module, thereby becoming a factor of cost rise of the powerconverter device.

-   [Patent Reference Literature 1] Japanese Laid-Open Patent    Publication No. 2008-29117

SUMMARY OF THE INVENTION Problems to be Solved by the Invention

The object of the present invention is to improve productivity of apower module and a power converter device.

Means for Solving the Problems

In order to solve the above problem, in a power module and a powerconverter device including the power module according to the presentinvention, a semiconductor circuit unit having a semiconductor device ishoused in a cylindrical case, and the semiconductor circuit unit issandwiched and supported by inner walls of the case via an insulatingmember that secures electrical insulation.

Advantageous Effect of the Invention

According to the present invention, productivity of a power module and apower converter device can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram showing a control block of a hybrid vehicle.

FIG. 2 is a diagram explaining the circuit structure of a powerconverter device.

FIG. 3 is an external perspective view of the power converter deviceaccording to an embodiment of the present invention.

FIG. 4 is a sectional view of the power converter device according to anembodiment of the present invention.

FIG. 5 is a perspective view of the first power module according to anembodiment of the present invention.

FIG. 6(a) is a sectional view of a resin molded type double-sidedelectrode module, which is a component of the power module according tothe present embodiment, and FIG. 6(b) is a perspective view of the resinmolded type double-sided electrode module.

FIG. 7 is a diagram showing an internal circuit configuration of thepower module.

FIG. 8(a) is a sectional view of the power module and FIG. 8(b) is aside view the power module.

FIG. 9(a) is an illustration of an assembly flow of a. CAN-like heatdissipating base and the resin molded type double-sided electrodemodule.

FIG. 9(b) is an illustration of an assembly flow of the CAN-like heatdissipating base and the resin molded type double-sided electrodemodule.

FIG. 9(c) is an illustration of an assembly flow of the CAN-like heatdissipating base and the resin molded type double-sided electrodemodule.

FIG. 10(a) is a perspective view of a housing in which a cooling waterinlet pipe and an outlet pipe are attached to an aluminium cast of thehousing including a cooling water flow path.

FIG. 10(b) is a top view of the housing in which the cooling water inletpipe and the outlet pipe are attached to the aluminium cast of thehousing including the cooling water flow path.

FIG. 10(c) is a sectional view of the housing in which the cooling waterinlet pipe and the outlet pipe are attached to the aluminium cast of thehousing including the cooling water flow path.

FIG. 11 is a seal structure diagram of a cooling jacket and the powermodule of the power converter device according to an embodiment of thepresent invention.

FIG. 12(a) is a sectional view of the second power module according toan embodiment of the present invention and FIG. 12(b) is a side view ofthe second power module.

FIG. 13(a) is a sectional view of the third power module according to anembodiment of the present invention and FIG. 13(b) is a side view of thethird power module.

FIG. 14(a) is a sectional view of the fourth power module according toan embodiment of the present invention and NG. 14(b) is a side view ofthe fourth power module.

FIG. 15(a) is a sectional view of the fifth power module according to anembodiment of the present invention and FIG. 15(b) is a side view of thefifth power module.

FIG. 16(a) is a sectional view of the sixth power module according to anembodiment of the present invention and FIG. 16(b) is a side view of thesixth power module.

FIG. 17 is a seal structure diagram of a cooling jacket and the powermodule of the power converter device according to an embodiment of thepresent invention.

FIG. 18 is a sectional view showing the connection structure of aninput/output terminal of the power module of the power converter deviceaccording to an embodiment of the present invention.

FIG. 19 is a sectional view showing the connection structure of theinput/output terminal of the power module of the power converter deviceaccording to an embodiment of the present invention.

FIG. 20 is a sectional view showing the connection structure of theinput/output terminal of the power module of the power converter deviceaccording to an embodiment of the present invention.

FIG. 21 is a sectional view showing the structure of the power moduleand the capacitor of the power converter device according to anembodiment of the present invention.

FIG. 22 is a sectional view showing the structure of the power moduleand the capacitor of the power converter device according to anembodiment of the present invention.

FIG. 23 is a sectional view showing a fixation method of the powermodule and the capacitor structure of the power converter deviceaccording to an embodiment of the present invention.

FIG. 24 is an illustration of a process flow showing a production methodof the CAN-like heat dissipating base 304 of the power module 300according to the present embodiment.

DESCRIPTION OF EMBODIMENTS

An embodiment of the present invention described later has been designedto meet many demands required for commercialization. The content ofPROBLEMS TO BE SOLVED BY THE INVENTION described above corresponds toone of the needs, and improved points related to other needs will now beexplained.

One of demands of the power module and the power converter deviceaccording to the present invention is to improve cooling performance ofthe power module and the power converter device while improvingproductivity thereof.

The power module according to the present invention and the powerconverter device using the same are then characterized by comprising twobase plates with their main surfaces facing each other, a semiconductorcircuit unit disposed between the two base plates, a connecting memberthat is connected to the two base plates and forms a housing region inwhich the semiconductor circuit unit is housed; and an insulating memberthat is placed between the base plate and the semiconductor circuit unitand for securing electrical insulation of the base plate and thesemiconductor circuit unit, wherein rigidity of the connecting member isless than that of the base plate.

As a result, the both sides of the semiconductor circuit unit can becooled through each of the two base plates, thereby increasing the heatdissipation area. In addition, the rigidity of the connecting member isset to be less than that of the base plate. Therefore, by applyingpressure to the two base plates that sandwich the semiconductor circuitunit, the power module case can be formed with ease, and thesemiconductor circuit unit, the insulating member, and the base plateare connected so that the heat transfer path, through Which heat can beexchanged with one another, can be formed with ease.

Another one of demands of the power module and the power converterdevice according to the present invention is to improve coolingperformance of the power module and the power converter device whilesecuring insulation properties thereof.

The power module according to the present invention and the powerconverter device using the same are then characterized by comprising acylindrical case, a semiconductor circuit unit housed in a housingregion formed in the case, and an insulating member for securingelectrical insulation of an inner wall of the case and the semiconductorcircuit unit, wherein the semiconductor circuit unit is sandwiched andsupported by inner walls of the case and the insulating member is placedbetween an inner wall of the case and the semiconductor circuit unit,and the insulating member is a material that improves adhesionproperties between the semiconductor circuit unit and the inner wall ofthe case by thermal processing.

The insulation properties between the semiconductor circuit unit and theinner wall of the case can be secured accordingly. In addition, adhesionproperties between the semiconductor circuit unit and the inner wall ofthe case are improved so as to inhibit separation from occurring betweenthe semiconductor circuit unit and the inner wall of the case and so asnot to reduce thermal conductance in the heat transfer path from thesemiconductor circuit unit to the case inner wall.

In addition, an outline of the power module and the power converterdevice according to the present embodiment will be explained beforespecific explanations are given on the power converter device accordingto an embodiment of the present invention.

The power module according to the present embodiment includes plate-likeelectrical wiring boards that are fixed to both electrodes that areprovided on both side surfaces of a plate-like power semiconductor,allowing electric power to flow through and a thermal energy to bereleased from both sides of the power semiconductor. In addition, partof the electrical wiring boards and the power semiconductor are packedwith a resin, and heat dissipation surfaces of both of the electricalwiring boards in the vicinity of the power semiconductor are exposedfrom part of the resin. The heat dissipation surfaces and resin surfacesform flat surfaces, and an adhesive insulation layer is formed on bothof the formed flat surfaces. In addition, the power semiconductor, theelectrical wiring boards, the part of resin, and both of the adhesiveinsulation layers are built into a CAN-like heat dissipating base whichhas two planes to be adhered to the formed adhesive insulation layer.Fins for heat dissipation are formed outside the CAN-like heatdissipating base so that heat can dissipate from the both sides of thepower semiconductor through the fins.

In the power converter device according to the present embodiment, acooling water path that can house the fins therein is provided in a caseof the power converter device. An insert opening into which the powermodule described earlier can be inserted is provided on the side surfaceof the cooling water path. A sealed structure of the cooling medium thatengages with a flange provided to the power module is formed on theperiphery of the insert opening.

In addition, in the power converter device according to the presentembodiment, a water path cover that seals the whole water path isprovided on an opening of the cooling water path opposite to the insertopening, and the power module and the water path cover constitute acooling jacket through which the cooling medium flows. The power moduleis cooled by submerging it into the cooling water path. A circuit thatcontrols the power semiconductor and controls the electric power supplyto a load is housed in a region in which the electrical wiring board ofthe power module protrudes, and a capacitor for smoothing the electricpower and a circuit that boosts input voltage are included in a regionbelow the water cooling jacket.

The power converter device according to an embodiment of the presentinvention will now be explained in detail with reference to thedrawings. The power converter device according to an embodiment of thepresent invention can be applied to a hybrid vehicle and a pure electricvehicle. As a representative example, the control structure and thecircuit structure of the power converter device when the power converterdevice according to an embodiment of the present invention is applied toa hybrid vehicle will now be explained with reference to FIG. 1 and FIG.2.

With regard to the power converter device according to an embodiment ofthe present invention, an explanation will be made in terms of anexample of a vehicle-mounted power converter device of a vehicle-mountedelectric machine system to be mounted on a vehicle, in particular, aninverter device for driving a vehicle used in an electric machine systemfor driving a vehicle, with the inverter device mounted and operatedunder a very harsh environment. The inverter device for driving avehicle is included in an electric machine system for driving a vehicleas a control device that controls drive of an electric machine fordriving a vehicle. The inverter device converts DC power supplied from avehicle-mounted battery that constitutes a vehicle-mounted power sourceor from a vehicle-mounted power generation device into predetermined ACpower, and supplies the obtained AC power to the electric machine fordriving a vehicle, so as to control drive of the electric machine fordriving a vehicle. In addition, since the electric machine for driving avehicle has a function as an electric generator, the inverter device fordriving a vehicle has a function to convert AC power generated by theelectric machine for driving a vehicle into DC power according to anoperation mode. The converted DC power is supplied to thevehicle-mounted battery.

It is to be noted that, while the present embodiment is configured to bemost appropriate for a power converter device for driving a vehicle,such as an automobile a truck, and the like, the present invention canalso be applied to other power converter devices. For instance, it canbe applied to a power converter device of an electric train, a vessel,an aircraft, and the like, an industrial power converter device used asa control device for an electric machine that drives plant equipment, ora household power converter device used for a control device of anelectric machine that drives a household photovoltaic power generationsystem and a household electrical appliances.

FIG. 1 is a diagram showing a control block of a hybrid vehicle. In FIG.1, a hybrid electric vehicle (hereinafter referred to as “HEV”) 110 isan electrically powered vehicle that includes two vehicle drive systems.One of them is an engine system with an engine 120, which is an internalcombustion engine, as a power source. The engine system is mainly usedas a driving source for the HEV 110. The other of them is avehicle-mounted electric machine system with motor generators MG1 192and MG2 194 as power sources. The vehicle-mounted electric machinesystem is mainly used as a driving source for the HEV 110 and anelectric power generation source for the HEV 110. The motor generatorsMG1 192 and MG2 194, which are, for example, synchronous machines orinduction machines, work as motors or electric generators depending uponthe operational method, and hence they are herein referred to as motorgenerators.

A front axle 114 is rotatably and pivotally supported in a front portionof the vehicle body. A pair of front wheels 112 is provided at both endsof the front axle 114. A rear axle (not shown in the figures) isrotatably and pivotally supported in a rear portion of the vehicle body.A pair of rear wheels is provided at both ends of the rear axle. Whilethe HEV 110 of the present embodiment adopts a so-called front-wheeldrive method, in which the front wheels 112 work as primary wheels to bedriven on power and the rear wheels work as secondary wheels thatfollow, it may adopt the contrary, i.e., a rear-wheel drive method.

A front wheel-side differential gear (hereinafter referred to as “frontwheel-side DEF”) 116 is provided at the middle of the front axle 114.The front axle 114 is mechanically connected to an output side of thefront-wheel side DEF 116. An output shaft of the transmission 118 ismechanically connected to an input side of the front-wheel side DEF 116.The front-wheel side DEF 116 is a differential power distributionmechanism that distributes rotational driving force that has beentransmitted through the transmission 118 to the right and left of thefront axle 114. An output side of the motor generator 192 ismechanically connected to an input side of the transmission 118. Anoutput side of the engine 120 and an output side of the motor generator194 are mechanically connected to an input side of the motor generator192 through a power distribution mechanism 122. It is to be noted thatthe motor generators 192 and 194 and the power distribution mechanism.122 are stored inside a housing of the transmission 118.

The motor generators 192 and 194 are synchronous machines includingpermanent magnets in rotors, and their drives are controlled as AC powerto be supplied to armature windings of stators is controlled by inverterdevices 140 and 142. A battery 136 is connected to the inverter devices140 and 142, so that electric power can be transferred between thebattery 136 and the inverter devices 140 and 142.

In the present embodiment, the HEV 110 includes two electric motorgenerator units, i.e., a first electric motor generator unit constitutedwith the motor generator 192 and the inverter device 140 and a secondelectric motor generator unit constituted with the motor generator 194and the inverter device 142, to be used according to the operationalstatus. More specifically, in order to assist drive torque of thevehicle in a situation in which the vehicle is driven on power from theengine 120, the second electric motor generator unit is activated, as apower generation unit, on power of the engine 120 so that it generateselectric power, and electric power obtained by the power generationcauses the first electric motor generator unit to be activated as amotorized unit. In addition, when assisting the vehicle speed in asimilar situation, the first electric motor generator unit is activated,as a power generation unit, on power of the engine 120 so that itgenerates electric power, and electric power obtained by the powergeneration causes the second electric motor generator unit to beactivated as a motorized unit.

In the present embodiment, the first electric motor generator unit isactivated on electric power of the battery 136 as a motorized unit sothat the vehicle can be driven only on power of the motor generator 192.Furthermore, in the present embodiment, the first electric motorgenerator unit or the second electric motor generator unit is activated,as a power generation unit, on power of the engine 120 or power from theWheels so as to generate electric power so that the battery 136 can becharged.

The battery 136 is also used as a power source for driving a motor 195for auxiliaries. The auxiliaries include a motor that drives acompressor of an air conditioner or a motor that drives a hydraulic pumpfor controlling. DC power supplied from the battery 136 to an inverterdevice 43 is converted into AC electric power by the inverter 43 forauxiliaries and supplied to the motor 195. The inverter 43 forauxiliaries has the same function as the inverter devices 140 and 142have, which controls phase, frequency, and electric power of AC to besupplied to the motor 195. For instance, by supplying lead phase ACpower with respect to rotation of the rotor of the motor 195, the motor195 generates torque. On the other hand, by generating lagging phase ACpower, the motor 195 works as an electric generator and the motor 195operates in a regenerative braking state. Such a control function of theinverter 43 for auxiliaries is the same as the control function of theinverter devices 140 and 142. Since the capacity of the motor 195 isless than that of the motor generators 192 and 194, the maximumconversion electric power of the inverter 43 for auxiliaries is lessthan that of the inverter devices 140 and 142. However, the circuitconfiguration of the inverter 43 for auxiliaries is basically the sameas that of the inverter devices 140 and 142.

The inverter devices 140, 142, and 43 and a capacitor module 500 are inan electrically close relationship. They require in common furthermeasures against heat generation. In addition, the volume of the deviceis desirably designed to be as small as possible. From those points, apower converter device 200 described later in detail houses the inverterdevices 140, 142, and 43 and the capacitor module 500 in the housing ofthe power converter device 200. This configuration allows the number ofharnesses to be reduced and radiated noise and the like to be reduced,thereby achieving a small sized, highly reliable power converter device.

Arranging the inverter devices 140, 142, and 43 and the capacitor module500 in one housing is effective in simplifying wiring and against noise.In addition, inductance in the connection circuit of the capacitormodule 500 and the inverter devices 140, 142, and 43 can be reduced sothat spike voltage can be reduced, and reduction in heat generation andimproved heat dissipation efficiency can be achieved.

Next, the circuit configuration of the power converter device 200 willbe explained with reference to FIG. 2. As shown in FIG. 1, the powerconverter device 200 includes the inverter devices 140 and 142, theinverter device 43 for auxiliaries, and the capacitor module 500.

The inverter devices 140 and 142 constitute three-phase bridge circuitsby connecting a plurality of the double-sided cooling power modules 300.As described later, each of the power modules has power semiconductordevices, connection wiring, an opening shown in a reference numeral 304in FIG. 6, and includes a can-like-shaped heat dissipating base 304(hereinafter referred to as “CAN-like heat dissipating base”), which isclosed except a surface of the opening, and the like. The CAN-like heatdissipating base 304 is a cooling device that has an exterior wall whichis made of the same material as heat dissipating bases facing each otherand is formed seamlessly with both the heat dissipating bases so as tocover the periphery of the heat dissipating bases, with the openingprovided on a part of the exterior wall and the power semiconductorshoused in the opening. The inverter 43 for auxiliaries constitutes aninverter device, a boost circuit, and a buck circuit.

Each of the inverter devices 140 and 142 is driven and controlled by twodriver circuits provided in a control unit. In FIG. 2, a set of the twodriver circuits is indicated as a driver circuit 174. Each of the drivercircuits is controlled by a control circuit 172. The control circuit 172generates a switching signal for controlling switching timing of thepower semiconductor devices for switching.

The inverter device 140 is constituted with the three-phase bridgecircuit and includes, for each of the U phase (represented by areference numeral U1), the V phase (represented by a reference numeralV1), and the W phase (represented by a reference numeral W1), a positiveelectrode side semiconductor switch unit that is connected to thepositive electrode side and a negative electrode side semiconductorswitch unit that is connected to the negative electrode side. Thepositive electrode side semiconductor switch unit and the negativeelectrode side semiconductor switch unit constitute an upper and lowerarm series circuit. The positive electrode side semiconductor switchunit includes an IGBT 328 (insulated gate bipolar transistor) and adiode 156 for the upper arm, which are power semiconductor device forswitching. The negative electrode side semiconductor switch unitincludes an IGBT 330 and a diode 166 for the lower arm. Each upper andlower arm series circuit is electrically connected in parallel between aDC positive electrode wiring board 314 and a DC negative electrodewiring board 316.

The IGBT 328 for the upper arm and the IGBT 330 for the lower arm arehereinafter referred to as the IGBTs 328 and 330.

The IGBTs 328 and 330 operate upon reception of a drive signal outputfrom one of the driver circuits of the driver circuit 174 so as toconvert DC power supplied from the battery 136 into three-phase ACpower. The converted electric power is supplied to an armature windingof the motor generator 192. It is to be noted that display of thereference numerals 328, 330, 156, and 166 will be curtailed with regardto the V phase and the W phase. The power module 300 of the inverterdevice 142 has the same configuration as that of the inverter device140, and the inverter 43 for auxiliaries has the same configuration asthat of the inverter device 142, and therefore explanations will becurtailed herein.

In the present embodiment, an example of power semiconductor devices forswitching is shown with the IGBTs 328 and 330. The IGBTs 328 and 330include collectors, emitters (emitter terminals for signals), and gateelectrodes (gate electrode terminals). The diodes 156 and 166 areelectrically connected between the collectors and the emitters of theIGBTs 328 and 330 as illustrated. The diodes 156 and 166 include twoelectrodes, i.e., cathodes and anodes, and the cathodes are electricallyconnected to the collectors of the IGBTs 328 and 330 and the anodes areelectrically connected to the emitters of the 328 and 330 so that thedirections from the emitter to the collectors of the IGBTs 328 and 330become the forward directions. A MOSFET (metal-oxide semiconductorfield-effect transistor) may be used as a power semiconductor device forswitching. In that case, the diode 156 and the diode 166 areunnecessary.

Based upon input information from a control device, a sensor (forinstance, an electric current sensor 180), or the like on the vehicleside, the control circuit 172 generates a timing signal for controllingswitching timing of the IGBTs 328 and 330. Based upon the timing signaloutput from the control circuit 172, the driver circuit 174 generates adrive signal for operating switching of the IGBTs 328 and 330.

The control circuit 172 includes a microcomputer for calculating andprocessing switching timing of the IGBTs 328 and 330. A desired torquevalue required for the motor generator 192, a current value suppliedfrom the upper and lower arm series circuit to the armature winding ofthe motor generator 192, and a magnetic pole position of the rotor ofthe motor generator 192 are input to the microcomputer as inputinformation. The desired torque value is based upon a command signaloutput from a higher-order control device not illustrated. The currentvalue is detected based upon a detection signal output from the electriccurrent sensor 180. The magnetic pole position is detected based upon adetection signal output from a rotating magnetic pole sensor (not shownin the figures) provided in the motor generator 192. While in thepresent embodiment the explanation is made based upon an example of acase in which three phase current values are detected, it may beconfigured that two phase current values are detected.

Based upon the desired torque value, the microcomputer in the controlcircuit 172 calculates current command values of d axis and q axis ofthe motor generator 192 and, based upon a difference between thecalculated current command values of the d axis and q axis and thedetected current values of the d axis and q axis, calculates voltagecommand values of the d axis and q axis. Furthermore, based upon thedetected magnetic pole position, the microcomputer converts thecalculated voltage command values of the d axis and q axis into thevoltage command values of the U phase, the V phase, and the W phase. Themicrocomputer then generates a pulse-like modulated wave based upon acomparison between a fundamental wave (sine wave) and a carrier wave(triangle wave) based upon the voltage command values of the U phase,the V phase, and the W phase, and outputs the generated modulated waveto the driver circuit 174 as a PWM (pulse-width modulated signal).

When driving the lower arm, the driver circuit 174 amplifies the PWMsignal and outputs the amplified signal as a drive signal to the gateelectrode of the IGBT 330 of a corresponding lower arm. When driving theupper arm, on the other hand, the driver circuit 174 shifts thereference potential level of the PWM signal to the reference potentiallevel of the upper arm before amplifying the PWM signal, and outputs theamplified signal as a drive signal to the gate electrode of the IGBT 328of a corresponding upper arm. As a result, switching of each of theIGBTs 328 and 330 is operated based upon the input drive signal.

In addition, the control unit performs abnormality detection (overcurrent, over voltage, over temperature, and the like) so as to protectthe upper and lower arm series circuit. For this purpose, sensinginformation is input to the control unit. For instance, information oncurrent flowing through the emitter of each of the IGBTs 328 and 330 isinput from a signal emitter terminal of each arm to the correspondingdriver circuit 174. This allows the driver circuit 174 to perform overcurrent detection, to stop the switching operation of the correspondingIGBTs 328 and 330 if over current is detected, and to protect thecorresponding IGBTs 328 and 330 from the over current. Information ontemperature at the upper and lower arm series circuit is input to themicrocomputer from a temperature sensor (not shown in the figures)provided in the upper and lower arm series circuit. Information onvoltage at the DC positive electrode side of the upper and lower armseries circuit is also input to the microcomputer. Based upon thosepieces of information, the microcomputer performs over temperaturedetection and over voltage detection, stops the switching operations ofall of the IGBTs 328 and 330 if over temperature or over voltage isdetected, and protects the upper and lower arm series circuit from theover temperature or the over voltage.

Conduction and interruption actions of the IGBTs 328 and 330 of theupper and lower arms of the inverter device 140 are switched in a fixedorder, and the current generated at the stator winding of the motorgenerator 192 during the switching flows through a circuit that includesthe diodes 156 and 166. It is to be noted that although, in the powerconverter device 200 of the present embodiment, one upper and lower armseries circuit is provided for each of the phases of the inverter device140, the power converter device may have a circuit configuration inwhich two upper and lower arm series circuits are connected in parallelfor each of the phases as a circuit that generates an output of each ofthe phases of three-phase AC to be output to the motor generators.

DC terminals 313 provided in each of the inverter devices 140 and 142are connected to a common laminated conductor plate 700. The laminatedconductor plate 700 constitutes a laminated wiring board with athree-layer structure in which an insulation sheet 706 (not shown in thefigures) is sandwiched by a positive electrode-side conductor plate 702and a negative electrode-side conductor plate 704, which are formed fromconductive plates with wider widths in an array direction of the powermodules. The positive electrode-side conductor plate 702 and thenegative electrode-side conductor plate 704 of the laminated conductorplate 700 are connected to a positive conductor plate 507 and a negativeconductor plate 505 of a laminated wiring board 501 provided in thecapacitor module 500, respectively. The positive conductor plate 507 andthe negative conductor plate 505, which are formed from conductiveplates with wider widths in an array direction of the power modules,also constitute a laminated wiring board with a three-layer structure inwhich an insulation sheet 517 (not shown in the figures) is sandwiched.

A plurality of capacitor cells 514 are connected in parallel to thecapacitor module 500, in which the positive electrode side of thecapacitor cells 514 is connected to the positive conductor plate 507 andthe negative electrode side is connected to the negative conductor plate505. The capacitor module 500 constitutes a smoothing circuit forinhibiting fluctuation in the DC voltage generated by the switchingoperation of the IGBTs 328 and 330.

The laminated wiring board 501 of the capacitor module 500 is connectedto an input laminated wiring board 230 that is connected to a DCconnector of the power converter device 200. An inverter device in theinverter 43 for auxiliaries is also connected to the input laminatedwiring board 230. A noise filter is provided between the input laminatedwiring board 230 and the laminated wiring board 501. The noise filterincludes two capacitors that connect a ground terminal of a housing 12with each DC power line so as to constitute a Y capacitor for measuresagainst common mode noise.

As shown in FIG. 10(a), a reference numeral 19A represents a coolingjacket on which a cooling water flow path is formed, and the coolingwater flows in through a cooling water inlet pipe 13, flows back andforth in a U shape as indicated by arrows, and flows out through acooling water outlet pipe 14. The inverter circuits 140 and 142 arearranged on a route through which the cooling water flows back andforth, and in either of the inverter circuits, the IGBT and the diode ofthe upper arm side are arranged on the forward path side of the coolingwater path and the IGBT and the diode of the lower arm side are arrangedon the return path side of the cooling water path.

In FIG. 3 to FIG. 6, the reference numeral 200 represents the powerconverter device, a reference numeral 10 represents an upper case, areference numeral 11 represents a metal base plate, a reference numeral12 represents the housing, the reference numeral 13 represents thecooling water inlet pipe, the reference numeral 14 represents thecooling water outlet pipe, a reference numeral 420 represents a waterpath back cover, a reference numeral 16 represents a lower case, areference numeral 17 represents an AC terminal case, a reference numeral18 represents an AC output wiring, a reference numeral 19 represents thecooling water flow path, and a reference numeral 20 represents a controlcircuit board that holds the control circuit 172. A reference numeral 21represents a connector for external connection, and a reference numeral22 represents a drive circuit board that holds the driver circuit 174.The control unit is thus constituted with the control circuit board 20,the control circuit 172, the drive circuit board 22, and the drivercircuit 174. The reference numeral 300 represents a power module(double-sided electrode module), and three power modules are provided ineach inverter. One set of the power modules 300 constitutes the inverterdevice 142 and the other set of the power modules 300 constitutes theinverter device 140. The reference numeral 700 represents the laminatedconductor plate, a reference numeral 800 represents a liquid seal, thereference numeral 304 represents the CAN-like heat dissipating base, thereference numeral 314 represents the DC positive electrode wiring board,the reference numeral 316 represents the DC negative electrode wiringboard, the reference numeral 500 represents the capacitor module, thereference numeral 505 represents the negative conductor plate, thereference numeral 507 represents the positive conductor plate, and thereference numeral 514 represents the capacitor cells.

FIG. 3 shows an external perspective view of the power converter device200 according to an embodiment of the present invention. The powerconverter device 200 according to the present embodiment includes thefollowing appearance parts, that is, the housing 12 with a substantiallyrectangular upper surface or bottom surface, the cooling water inletpipe 13 and the cooling water outlet pipe 14 provided on one of outercircumferences on the short side of the housing 12, the upper case 10for covering an upper opening of the housing 12, and the lower case 16for covering a lower opening of the housing 12. The shape of the bottomsurface side or the upper surface side of the housing 12 is formed to besubstantially rectangular so as to be mounted on a vehicle with ease andmanufactured with ease, in particular in mass production.

The AC terminal case 17 used for connection with each of the motorgenerators 192 and 194 is provided on the outer circumference on thelong side of the power converter unit 200. The AC output wiring 18 isused for electrically connecting the power module 300 with the motorgenerators 192 and 194. The alternating current output from the powermodule 300 is transmitted to the motor generators 192 and 194 throughthe AC output wiring 18.

The connector 21 is connected to the control circuit board 20 housed inthe housing 12. A variety of signals from outside are transmitted to thecontrol circuit board 20 through the connector 21. A DC (battery)negative electrode side connection terminal unit 510 and a DC (battery)positive electrode side connection terminal unit 512 electricallyconnect the battery 136 with the capacitor module 500. Here, in thepresent embodiment, the connector 21 is provided on one side of theouter circumference surface of the short side of the housing 12. On theother hand, the DC (battery) negative electrode side connection terminalunit 510 and the DC (battery) positive electrode side connectionterminal unit 512 are provided on the outer circumference surface of theshort side that is opposite to the side on which the connector 21 isprovided. In other words, the connector 21 and the DC (battery) negativeelectrode side connection terminal unit 510 are arranged separately.This results in reduction in the noise that comes into the housing 12through the DC (battery) negative electrode side connection terminalunit 510 and is then propagated to the connector 21, thereby improvingcontrollability of the motor by the control circuit board 20. Theterminal units 510 and 512 are provided in a DC connector 138 of FIG. 2.

FIG. 4 is a sectional view of the power converter device according to anembodiment of the present invention.

As shown in HG 4, the cooling jacket 19A in which the cooling water flowpath 19 is formed is provided in the middle of the housing 12, and, onthe top of the cooling jacket 19A, there are two sets of openings 400and 402 each formed in three rows along the direction of the flow, whichconstitute six openings (refer to FIG. 10(b)). Each of the power modules300 is fixed to the upper surface of the cooling jacket 19A through theliquid seal 800. Fins 305 for heat dissipation are provided opposite toeach other on the CAN-like heat dissipating base 304 of each of thepower modules 300. The fins 305 of each of the power modules 300 eachprotrude into the cooling water flow path 19 through the openings 400and 402 of the cooling jacket 19A. The protruding CAN-like heatdissipating base 304 and a column-like part of the cooling jacket 19Aseparate the cooling water path 19 to the right and left and cause thecooling medium to shunt and flow separately′ through the opposite fins305. The cooling water path 19 is provided in the cooling jacket 19A asit meanders in S shape so that it can cool six power modules arranged inseries.

An opening 404 is formed along the cooling water path 19 on the lowersurface of the cooling jacket 19A, and the opening 404 is covered withthe lower water path back cover 420. The inverter 43 for auxiliaries ismounted and cooled on the lower surface of the cooling jacket 19A. Theinverter 43 for auxiliaries is fixed to the lower surface of the lowerwater path back cover 420 so that heat dissipation metal surfaces ofhoused power modules and the like (not shown in the figures) face thelower surface of the cooling jacket 19A. The liquid seal 800 is providedbetween the lower water path back cover 420 and the housing 12. Whilethe liquid seal is used as a sealing material in the present embodiment,a resin material, a rubber O-ring, packing, or the like may be used inplace of the liquid seal. A use of a liquid seal can improveassemblability of the power converter unit 200.

The lower case 16 is provided below the cooling jacket 19A, and thecapacitor module 500 is provided in the lower case 16. The capacitormodule 500 is fixed on a bottom plate inner surface of the lower case 16so that the heat dissipation surface of the metal case of the capacitormodule 500 contacts the bottom plate inner surface of the lower case 16.This configuration allows the power modules 300 and the inverter 43 forauxiliaries to be efficiently cooled using the upper surface and thelower surface of the cooling jacket 19A, thereby resulting in a powerconverter device reduced in size.

While the housing 12, in which the cooling jacket 19A is provided, iscooled. the lower case 16 provided below the housing 12 is also cooled.As a result, heat in the capacitor module 500 is thermally conducted tothe cooling water through the lower case 16 and the housing 12, and thusthe capacitor module 500 is cooled.

The laminated conductor plate 700 for electrically connecting the powermodules 300 with the capacitor module 500 is arranged above the powermodules 300. The laminated conductor plate 700 spans over the inputterminal 313 of each of the power modules 300 so as to connect each ofthe power modules 300 in parallel. The laminated conductor plate 700 isconstituted with the positive electrode-side conductor plate 702 (referto FIG. 20), which is connected with the positive conductor plate 507 ofthe capacitor module 500, the negative electrode-side conductor plate704 (refer to FIG. 20), which is connected with the negative conductorplate 505 of the capacitor module 500, and an insulation sheet 7000disposed between the conductor plates 702 and 704. Wire lengths of theconductor plates 505 and 507 can be reduced by arranging the conductorplates 505 and 507 to penetrate a water path dividing wall that isformed by the meander of the cooling water path 19 of the cooling jacket19A, thereby reducing parasitic inductance from the power modules 300 tothe capacitor module 500.

The control circuit board 20 and the drive circuit board 22 are arrangedabove the laminated conductor plate 700. The driver circuit 174, shownin FIG. 2, is mounted on the drive circuit board 22, and the controlcircuit 172 which includes a CPU shown in FIG. 2 is mounted on thecontrol circuit board 20. In addition, a metal base plate 11 is disposedbetween the drive circuit board 22 and the control circuit board 20. Themetal base plate 11 has a function of an electromagnetic shield for agroup of circuits mounted on the both boards 22 and 20 and dissipatesthe heat generated at the drive circuit board 22 and the control circuitboard 20 to cool them. Thus, the power converter device can beefficiently cooled in a small space and the whole power converter devicecan be reduced in size by providing the cooling jacket 19A in the middleof the housing 12, arranging the power modules 300 for driving the motorgenerators 192 and 194 on one side of the cooling jacket, and arrangingthe inverter device (power module) 43 for auxiliaries on the other side.Integrally producing the cooling jacket 19A with the housing 12 withaluminium casting has an effect to increase cooling effect andmechanical strength of the cooling jacket 19A. Since the housing 12 andthe cooling jacket 19A have an integrally molded structure withaluminium casting, thermal conductivity is improved, thereby improvingcooling efficiency for the drive circuit board 22, the control circuitboard 20, and the capacitor module 500, which are positioned far fromthe cooling jacket 19A.

A flexible wiring 23, which passes through the metal base plate 11 toconnect the group of circuits of each of the circuit boards 20 and 22,is provided on the drive circuit board 22 and the control circuit board20. The flexible wiring 23 has a structure in which the flexible wiringis laminated in the wiring board in advance and fixed with a jointingmaterial such as a solder to a wiring pattern on the top of the wiringboard. An electrode of the flexible wiring 23 is penetrated in athrough-hole provided in advance in the wiring board and is fixed with ajointing material such as a solder. A switching timing signal of theinverter circuit is transmitted from the control circuit board 20 to thedrive circuit board 22 through the flexible wiring 23, and the drivecircuit board 22 generates a gate drive signal and applies it to eachgate electrode of the power modules. The use of the flexible wiring 23thus allows a head of a conventionally used connector to be unnecessary,packaging efficiency of the wiring board to be improved, and the numberof components to be reduced, thereby achieving inverters reduced insize. The control circuit board 20 is connected to the connector 21 thatperforms external electrical connection. The connector 21 is used totransmit signals with the vehicle-mounted battery 136 provided outsidethe power converter device, i.e., a lithium battery module. Signals thatindicate the state of battery, the state of charge of the lithiumbattery, and the like are sent from the lithium battery module to thecontrol circuit board 20.

Openings are formed at the upper end and the lower end of the housing12. Those openings are covered by fixing each of the upper case 10 andthe lower case 16 to the housing 12 with fastener components such asscrews or bolts. The cooling jacket 19A, in which cooling water flowpath 19 is provided, is formed in a substantially middle of the heightdirection of the housing 12. An upper surface opening of the coolingjacket 19A is covered with each of the power modules 300 and a lowersurface opening of the cooling jacket is converted with the lower waterpath back cover 420 so as to form the cooling water flow path 19 insidethe cooling jacket 19A. A water leak test for the cooling water flowpath 19 is conducted in the middle of assembly. Then, after passing thewater leak test, boards and the capacitor module 500 are mounted throughthe upper and lower openings of the housing 12. Thus, it is arrangedthat the cooling jacket 19A is disposed in the middle of the housing 12and then necessary components are fixed through the openings of theupper end and the lower end of the housing 12, thereby improvingproductivity. In addition, it is possible that the cooling water flowpath 19 is completed first and, after a water leak test, othercomponents are attached, thereby improving both productivity andreliability.

In FIG. 5, the reference numeral 304 represents the seamless CAN-likeheat dissipating base, which has the exterior wall formed of the samematerial as the heat dissipating bases facing each other and coveringthe periphery of the heat dissipating bases. The opening is provided onthe part of the exterior wall, and the power semiconductors are housedin the opening. The reference numeral 314 represents the DC positiveelectrode wiring board connection section, the reference numeral 316represents the DC negative electrode wiring board connection section,and the reference numerals 320U and 320L represent control terminals ofthe power module.

The power module 300 of the present embodiment is constituted with theseamless CAN-like heat dissipating base 304 formed of metal materialssuch as Cu, Al, AlSiC, Cu—C, and Al—C, and a double-sided electrodemodule 300A in which an electrical wiring board 334 formed from theexternal connection terminals 314, 316, 320U, and 320L and the powersemiconductors are molded with a resin material 302 (refer to FIG.6(a)), and includes an AC terminal 705 of the U, V, or W phase forconnecting with the motor which is a load.

The power module 300 of the present embodiment is characterized in thatthe double-sided electrode module 300A, which is an electrical componentwith less water resistance, is built in to the seamless CAN-like heatdissipating base 304, which directly contacts the cooling medium. Thisprevents the cooling medium such as water or oil not from directlycontacting the double-sided electrode module 300A. The seamless CAN-likeheat dissipating base 304, free from seams of metal and adhesivematerials such as a resin, is used for the structure of the heatdissipating base, thereby preventing the cooling medium from penetratingand flowing into through the heat dissipating base side and allowing thepower semiconductors to be highly reliable. In the case of failure inthe power semiconductors, reliability reduction in the power converterdevice that results from water leak due to secondary failure in the heatdissipating base can be prevented, thereby providing a highly reliablepower converter device.

FIG. 6(a) is a sectional view of the resin molded type double-sidedelectrode module 300A, which is a component of the power module 300, andFIG. 6(b) is a perspective view of the resin molded type double-sidedelectrode module 300A. In FIG. 6(a), the IGBTs 328 and 330, the diodes156 and 166, and the like of the upper and lower arms are arrangedbetween a pair of the electrical wiring boards 334 in the double-sidedelectrode module 300A. The collector sides of the IGBTs 328 and 330 arefixed to the DC positive electrode wiring board 314 through a metaljointing material 337 such as a soldering material or a silver sheet,and a heat spreader plate 338 is fixed with the metal jointing material337 to the emitter sides of the IGBTs 328 and 330. The heat spreaderplate 338 is fixed with the metal jointing material 337 to the DCnegative electrode wiring board 316. FIG. 7 shows the circuitconfiguration for one phase of the inverter circuit built in the powermodule 300. A wiring layout of the electrical wiring board 334 isprepared so that the inverter circuit for one phase can be constitutedwith the IGBTs 328 and 330 and the diodes 156 and 166, and the upper andlower arms are connected with an upper and lower arms wiring board 370that connects the DC positive electrode wiring board 314 with the DCnegative electrode wiring board 316. It is to be noted that the circuitsfor the three phases that constitute the inverter circuit may be builtin to the power module 300, and alternatively, a circuit only for theupper arm of one phase may be built in to the power module 300. As shownin FIG. 6(a), the IGBTs 328 and 330 and the diodes 156 and 166 of theupper and lower arms are sandwiched with each of the electrical wiringboards 334 and integrated with the resin material 302. Heat dissipationsurfaces 334B of both of the electrical wiring boards 334 in thevicinity of the power semiconductors are exposed through a part of theresin material 302, a flat surface 334C is formed from the heatdissipation surfaces 334B and the resin material 302, and an adhesiveinsulation layer 334A is formed on each of the formed surfaces 334C,thereby improving insulation properties and thermal conductivity. Theelectrical wiring boards 334 may be made of Cu and Al. The adhesiveinsulation layer 334A may be a thin insulation sheet made from a mixtureof an epoxy resin and a thermally conductive filler. Thickness can beaccurately determined on the sheet-like insulation layer compared withgrease, adhesive materials, or the like, and, in addition, voidformation can be reduced, thereby significantly reducing fluctuations inthermal resistance and insulation properties. The insulation layer maybe a ceramic plate or an adhesive board on which an adhesive material isapplied to both sides of a ceramic plate. The adhesive insulation layers334A and the CAN-like heat dissipating base 304 are adhered so as toform a heat dissipation route with excellent heat dissipation from bothsides of the power semiconductors.

The resin molded type double-sided electrode module 300A that is builtin to the power module 300 of the present embodiment is characterized byincluding a connection structure in which the heat dissipation surfaces334B of both of the electrical wiring boards 334 are fixed to an innerside wall of the seamless CAN-like heat dissipating base 304 through theadhesive insulation layers 334A. In this manner, the resin molded typedouble-sided electrode modules 300A, which are power semiconductorperipheries, can be individually formed, and operation verification ofthe power semiconductors and inspection of the connection of the powersemiconductors and the electrical wiring boards 334 can be conducted notthrough the heat dissipating base, thereby allowing the powersemiconductors to be highly reliable and thus allowing the powerconverter device to be highly reliable.

In addition, in other words, the CAN-like heat dissipating base 304 ofthe present embodiment is a cylindrical case with a bottom which has anopening on one side. Then, the double-sided electrode module 300A, whichconstitutes the semiconductor circuit unit, is housed in a housingregion formed in the CAN-like heat dissipating base 304. The insulationlayer 334A, which is an insulating member, is included so as to ensureelectrical insulation between the inner walls of the CAN-like heatdissipating base 304 and the double-sided electrode module 300A. Thedouble-sided electrode module 300A is sandwiched and supported by theinner walls of the CAN-like heat dissipating base 304. In addition, theinsulation layers 334A are placed between the inner walls of theCAN-like heat dissipating base 304 and the double-sided electrode module300A, and, by thermal processing as described later, are formed of amaterial that improves adhesion properties of the double-sided electrodemodule 300A and the inner walls of the CAN-like heat dissipating base304.

In the above manner, the insulation properties of the double-sidedelectrode module 300A and the inner walls of the CAN-like heatdissipating base can be secured. In addition, adhesion properties of thedouble-sided electrode module 300A and the inner walls of the CAN-likeheat dissipating base are improved so as to inhibit separation fromoccurring between the double-sided electrode module 300A and the innerwalls of the CAN-like heat dissipating base and so as not to reducethermal conductance in the heat transfer path from the double-sidedelectrode module 300A to the CAN-like heat dissipating base.

In addition, in other words, two base plates 304B and 304C that form theheat dissipation surfaces are arranged to face each other in theCAN-like heat dissipating base 304 of the present embodiment, and theyare connected via an outer circumference curved portion 304A. In otherwords, the outer circumference curved portion 304A works as a connectingmember of the two base plates 304B and 304C. The connecting memberincludes a circumference section 304D that surrounds an outercircumference of one of the two base plates 304B and 304C. Theinsulation layers 334A are placed between the inner walls of the housingregion formed from the two base plates and the outer circumferencecurved portion 304A and the double-sided electrode module 300A. Here,the rigidity of the outer circumference curved portion 304A describedearlier is set to less than that of the two base plates. Alternatively,the thickness of the outer circumference curved portion 304A describedearlier is set to less than that of the two base plates.

As a result, the both sides of the semiconductor circuit unit can becooled through each of the two base plates 304B and 304C, therebyincreasing the heat dissipation area. Since the rigidity of theconnecting member is set to less than that of the base plate, byapplying pressure to the two base plates 304B and 304C as they sandwichthe semiconductor circuit unit, the power module case can be formed withease, and the semiconductor circuit unit, the insulating member, and thebase plate 304B and 304C are connected so that the heat transfer path,through which heat can be exchanged with one another, can be formed withease.

It is to be noted that although in the present embodiment, the outercircumference curved portion 304A, which works as a connecting member ofthe two base plates 304B and 304C, is formed integrally with the baseplate, it may be arranged to join the two base plates 304B and 304C as aseparate member by welding or the like. Also in that case, the rigidityor the thickness of the outer circumference curved portion 304A is setto less than that of the two base plates 304B and 304C.

FIG. 8(a) shows a sectional view of the power module 300 and FIG. 8(h)shows a side view of the power module 300. In FIG. 8(a), thedouble-sided electrode module 300A is housed in the seamless CAN-likeheat dissipating base 304, fixed in the CAN-like heat dissipating base304 with the adhesive insulation layer 334A, thus constituting anintegrated structure. As shown in FIG. 8(b), the pin-like fins 305 areformed on the outer side surface of the CAN-like heat dissipating base304 opposite to the heat dissipation surfaces 334B of the bothelectrical wiring boards 334 of the double-sided electrode module 300A,and the pin-like fins 305 are arranged to cover the outer circumferenceof the CAN-like heat dissipating base 304. The CAN-like heat dissipatingbase 304 and the pin-like fins 305 are integrally shaped with the samematerial and alumited all over the surface so as to improveanticorrosive properties and resin adhesive performance of the CAN-likeheat dissipating base 304. Each of the fins 305 contacts the coolingmedium flowing through the cooling water path so as to enable heat todissipate from the both side surfaces of the power semiconductor, andthe heat transfer route from the power semiconductor to the coolingmedium is parallelized so as to allow the thermal resistance to bereduced significantly. As a result, it is possible to reduce the powersemiconductor in size and also reduce the power converter device insize.

FIG. 9(a) shows an assembly flow and a sectional view of integration ofthe CAN-like heat dissipating base 304 and the resin molded typedouble-sided electrode module 300A. In FIG. 9(a), a structure in whichthe thickness of the adhesive portion of the CAN-like heat dissipatingbase 304 that adheres to the heat dissipation surfaces 334B is madethicker than the outer circumference curved portion 304A is adopted inthe CAN-like heat dissipating base 304. At first, (1) the double-sidedelectrode module 300A is placed inside the CAN-like heat dissipatingbase 304 through the opening. Next, (2) the double-sided electrodemodule 300A is pressurized from outside the CAN-like heat dissipatingbase 304 so that the adhesive insulation layers 334A, which cover theheat dissipation surfaces 334B of the double-sided electrode module300A, are fixed to the inner walls of the CAN-like heat dissipating base304, and the outer circumference curved portion 304A of the CAN-likeheat dissipating base 304 is deformed. This allows the gap between theadhesive insulation layers 334A and the CAN-like heat dissipating base304 to be cleared and the CAN-like heat dissipating base 304, which isto be connected with the heat dissipation surfaces 334B, to be adheredand fixed. Heat generated by the power semiconductor is transferred tothe CAN-like heat dissipating base 304 through the adhesive insulationlayer 334A provided on the both side surfaces of the double-sidedelectrode module 300A, so that the heat can dissipate from the bothsides of the power semiconductor. The heat transfer route from the powersemiconductor to the cooling medium is divided into two routes inparallel, so that thermal resistance can be reduced significantly, andhence both the power semiconductor and the power converter device can bereduced in size.

FIG. 9(b) shows an assembly flow and a sectional view of integratedconnection of the double-sided electrode module 300A with the seamlessCAN-like heat dissipating base 304. In FIG. 9(b), a structure in whichthe thickness of the adhesive portion of the CAN-like heat dissipatingbase 304 that adheres to the heat dissipation surfaces 334B is madethicker than the outer circumference curved portion 304A is adopted inthe CAN-like heat dissipating base 304. At first, (1) the inside of theCAN-like heat dissipating base 304 is deformed so as to expand the innerspace by moving in parallel the surfaces of the heat dissipating base tobe connected with the heat dissipation surfaces 334B of the double-sidedelectrode module 300A, and thus the outer circumference curved portion304A of the CAN-like heat dissipating base 304 is deformed and theopening of the CAN-like heat dissipating base 304 is widened. Next, (2)the double-sided electrode module 300A is inserted in the CAN-like heatdissipating base 304 through the opening. Lastly, (3) the double-sidedelectrode module 300A is pressurized from outside the CAN-like heatdissipating base 304 so that the adhesive insulation layers 334A, whichcover the heat dissipation surfaces 334B of the double-sided electrodemodule 300A, are fixed to the inner walls of the CAN-like heatdissipating base 304, and the outer circumference curved portion 304A ofthe CAN-like heat dissipating base 304 is deformed. This allows the gapbetween the adhesive insulation layer 334A and the CAN-like heatdissipating base 304 to be cleared, the CAN-like heat dissipating base304 which is to be connected with the heat dissipation surfaces 334B tobe adhered to and fixed with the heat dissipation surfaces 334B whileminimizing deformation in the heat dissipation fins. Heat generated bythe power semiconductor is transferred to the CAN-like heat dissipatingbase 304 through the adhesive insulation layer 334A provided on the bothside surfaces of the double-sided electrode module 300A, so that theheat can dissipate from the both sides of the power semiconductor. Theheat transfer route from the power semiconductor to the cooling mediumis divided into two routes in parallel, so that thermal resistance canbe reduced significantly, and hence both the power semiconductor and thepower converter device can be reduced in size.

FIG. 9(c) is an assembly flow for integrated connection of thedouble-sided electrode module 300A with the seamless CAN-like heatdissipating base 304, and is a sectional view of FIG. 9(b). FIG. 9(c)shows an assembly process to fix the adhesive insulation layers 334Awith the inner walls of the CAN-like heat dissipating base 304. The fins305 of the CAN-like heat dissipating base 304 are pressurized with apressing machine 307 in which an overheating heater 306 or the like isincluded so that the heat dissipating base adheres to the adhesiveinsulation layers. At that time, the double-sided electrode module 300Aperiphery is vacuumized so as to discharge an air reservoir such as avoid occurring on an interface of the adhesive insulation layer 334A. Inaddition, by burning at a high temperature for a few hours, hardening ofthe adhesive material can be facilitated. Since those result in improvedreliability of an insulation life and the like of the insulation layer334A, a small-sized, highly-reliable power converter device can beprovided.

It is desirable for the insulation layer 334A to have adhesionproperties when the inner side wall of the CAN-like heat dissipatingbase 304 and the double-sided electrode module 300A are joined by beingpressurized from side walls on both sides of the power is module 300 asthe power module 300 according to the present embodiment. It is alsodesirable for the insulation layer 334A to be formed of a material whichthermally cures upon change in temperature caused by the overheatingheater 306 described earlier. This allows the CAN-like heat dissipatingbase 304 to undergo the forming process by the pressing machine 307 andthe adhesion process by the insulation layer 334A simultaneously orrapidly.

The insulation layer 334A that is preferable for the power module 300according to the present embodiment will now be explained. Theinsulation layer 334A according to the present embodiment is required tosecure electrical insulation properties and adhesion properties betweenthe inner side wall of the CAN-like heat dissipating base 304 and thedouble-sided electrode module 300A. However, the heat dissipationsurfaces 334B of the double-sided electrode module 300A is formed ofelectrical wiring, the resin material 302, and the like as shown in FIG.6(b). Therefore, irregularity occurs at a boundary between theelectrical wiring and the resin material 302, and adhesion propertieswith the insulation layer 334A may be reduced. As a result, air or thelike intrudes between the insulation layer 334A and the double-sidedelectrode module 300A, and thus the heat transfer rate of the powermodule 300 may be greatly reduced.

It is hence desirable to form the insulation layer 334A with aninsulating material that is flexible, i.e., with low Young's modulus, soas to fill in irregularity at the boundary between the electrical wiringand the resin material 302.

On the other hand, as the insulating material with low Young's moduluscontains many impurities that are different from those for securing theelectrical insulation properties, electrical insulation properties maynot be sufficiently secured. Therefore, the insulation layer 334Aaccording to the present embodiment further includes an insulatingmaterial with less impurities, i.e., high Young's modulus, between theinsulating material with low Young's modulus described earlier and theinner side wall of the CAN-like heat dissipating base 304. In otherwords, the insulation layer 334A constitutes a multilayer configurationwith insulating materials having different Young's moduli. This allowsreduction in the heat transfer rate to be inhibited and the electricalinsulation properties to be secured.

Furthermore, the inner side wall of the CAN-like heat dissipating base304 is required to constitute an irregular configuration due to thereason described later referring to FIG. 12. In this case, theinsulating material with low Young's modulus described earlier isprovided on the side toward the inner wall of the CAN-like heatdissipating base 304 so as to inhibit reduction in the heat transferrate between the inner side wall of the CAN-like heat dissipating base304 and the insulation layer 334A. More specifically, the insulationlayer 334A is formed of the insulating material with low Young's modulusin the upper layer and the lower layer and the insulating material withhigh Young's modulus in the middle layer. This allows reduction in theheat transfer rate to be inhibited and the electrical insulationproperties to be secured even in the case of an embodiment such as inFIG. 12.

FIGS. 10(a) to (c) are illustrations of the aluminium cast of thehousing 12 including the cooling jacket 19A to which the cooling waterinlet pipe and the outlet pipe are attached. FIG. 10(a) is a perspectiveview of the cooling jacket 19A, FIG. 10(b) is a top view of the housing12, and FIG. 10(c) is a sectional view of the housing 12. As shown inFIGS. 10(a) to (c), the cooling jacket 19A, in which the cooling waterflow path 19 is formed, is integrally casted in the housing 12. Thecooling water inlet pipe 13, through which cooling water is taken in andthe cooling water outlet pipe 14 are provided on one of the sidesurfaces of the short side of the housing 12, whose plan shape issubstantially rectangular.

In FIG. 10(a), the cooling water flows into the cooling water flow path19 through the cooling water inlet pipe 13, and is divided into two andflows along the long side of the rectangle, which is the direction of anarrow 418. The cooling water returns as indicated by an arrow 421 a at acorner portion 19C in the vicinity of the other side surface of theshort side of the rectangle, and is divided into two and flows in thedirection of an arrow 422 along the long side of the rectangle again.The cooling water further flows along the long side of the rectangle,turns around as indicated by an arrow 421 b, flows into the outlet pipeprovided on the lower cooling water path cover 420, returns, and flowsout to the cooling water outlet pipe 14 through an outlet hole (refer toFIG. 10(b)). There are six of the openings 400 bored on the uppersurface of the cooling jacket 19A. The CAN-like heat dissipating base304 of each of the power modules 300 protrudes into the flow of thecooling water through each of the openings. Pressure loss can be reducedby dividing the cooling water into two with the CAN-like heatdissipating base 304 and column-like flow dividing boundaries 19B of thecooling jacket 19A. The cooling water is divided into two also byconfiguring the outer circumference curved portion 304A of the CAN-likeheat dissipating base 304 into a curved surface, thereby resulting inreduction in pressure loss. In addition, rise of pressure loss can bereduced also by causing the flow path to meander in S shape so as tocool six power modules arrayed in series, thereby improving coolingefficiency. Each of the power modules 300 is fixed so as to cover theopenings of the cooling jacket 19A in a watertight manner through asealing material such as the liquid seal 800.

In FIG. 10(b), the cooling jacket 19A is formed integrally with thehousing 12 across the middle portion of a housing peripheral wall 12W.The six openings 400 and 402 are provided on the upper surface of thecooling jacket 19A and the one opening 404 is provided on the lowersurface thereof. A power module mounting surface 410S is provided on theperiphery of each of the openings 400 and 402. Threaded holes 412 arethreaded holes for fixing to the cooling jacket 19A a module fixture304C for pressing the power module to the mounting surface 410S (referto FIG. 11). A plurality of power modules 300 can be pressed to thecooling jacket 19A with the module fixture 304C. This results inreduction in the number of screws that apply pressure to and fix thepower module 300 to the cooling jacket, thereby improvingassemblability. Furthermore, the cooling jacket 19A can be reduced insize and a flange of the CAN-like heat dissipating base 304 of the powermodule can be reduced in size, the cooling jacket 19A, the housing 12,and the power module 300 can be reduced in size, thereby contributinggreatly to reduction in size of the power converter device 200. Thepower semiconductors built in to the power module 300 can be cooled fromthe both sides with the divided cooling water, thereby having anadvantage of reduction in thermal resistance. Pedestals 304D, with whichthe control circuits 20 and 21 and the heat dissipating base 11 arefixed, are provided on the module fixture 304C.

The cooling jacket 19A includes a dividing wall portion for forming thecooling water flow path 19. A plurality of through holes 406 are formedin the dividing wall portion on the side portion of each of the powermodules 300. More specifically, two of the through holes 406 thatcorrespond to the U phase are formed on the dividing wall portionbetween the power modules 300 that constitute the U phase and theexterior wall of the housing 12. Two of the through holes 406 thatcorrespond to the V phase are formed on the dividing wall portionbetween the power modules 300 that constitute the U phase and the powermodules 300 that constitute the V phase. Two of the through holes 406that correspond to the W phase are formed on the dividing wall portionbetween the power modules 300 that constitute the V phase and the powermodules 300 that constitute the W phase. As shown in FIG. 4, thecapacitor module 500 is arranged below the power modules 300. On theother hand, the DC terminal of the power module 300 protrudes upward thepower module 300. Each of the positive conductor plate 507 and thenegative conductor plate 505 extending from the capacitor module 500protrude through each of the through holes 406 so as to be connectedwith the DC terminal of the power module 300. As a result, since thebalance of wiring distance for each of the phases from the capacitormodule 500 to the power module 300 can be adjusted, the balance ofwiring inductance can be uniformed as much as possible for each of thephases. Moreover, since each of the through hole 406 is formed on theside portion of each of the power modules 300 and the direction ofprotrusion of the positive conductor plate 507 and the negativeconductor plate 505 through the through hole 406 becomes the same as thedirection of protrusion of the DC terminal of the power module 300, thedistance required to connect the DC terminal of the power module 300with the positive conductor plate 507 and the negative conductor plate505 becomes short and since the connection becomes easy so that thewiring inductance can be reduced.

FIG. 11 is a sectional view showing a seal section of the power module300 and the cooling jacket 19A according to the present embodiment.

In FIG. 11, the cooling jacket 19A is formed integrally with the housing12 across the middle portion of the housing peripheral wall 12W, and theopening 400 is provided on the upper surface of the cooling jacket 19Aand the opening 404 of the cooling water path is provided on the lowersurface thereof. The power module mounting surface 410S is provided onthe periphery of the opening 400. An engagement section 420A forengagement with the lower cooling water path cover 420, is provided onthe periphery of the opening 404 and sealed with the liquid sealmaterial 800. The threaded holes 412 are screw holes for fixing to thecooling jacket 19A the module fixture 304C for pressing a flange 300B ofthe power module 300 to the mounting surface 410S. Since the pluralityof power modules 300 can be pressed to the cooling jacket 19A with themodule fixture 304C, the liquid seal material applied in advance betweenthe mounting surface 410S and the flange 300B of the power module 300 iscrushed and the power modules 300 are pressurized, thereby inhibitingthe cooling medium from leaking through between the mounting surface410S and the power module 300. The number of screws that apply pressureto the power module 300 and fix the power module 300 to the coolingjacket 19A can be reduced, and hence assemblability can be improved.Since the cooling jacket 19A can be reduced in size and the flange 300Bof the CAN-like heat dissipating base 304 of the power module 300 can bereduced in size, the cooling jacket 19A, the housing 12, and the powermodule 300 can be reduced in size, thereby contributing greatly toreduction in size of the power converter device 200. The powersemiconductors built in to the power module 300 can be cooled from theboth sides with the divided cooling water, thereby having an advantageof reduction in thermal resistance. It is to be noted that a rubberO-ring or the like have a similar effect as a liquid seal material.

FIG. 12(a) is a sectional view of a second power module 300 according tothe present embodiment, and FIG. 12(b) is a side view of the secondpower module 300.

The differences from the above embodiment are as follows. That is, thefins 305 provided on the cooling surface outside the CAN-like heatdissipating base 304 are not formed of a homogeneous material at thesame time when the CAN-like heat dissipating base 304 is formed butformed by bonding afterward resin fins 305A, which are excellent inthermal conductivity, to outside the CAN-like heat dissipating base 304.Moreover, irregularities 305B are provided on the surface of theCAN-like heat dissipating base 304 so as to prevent the resin fins 305Afrom dropping and the irregularities 305B and the resin fins 305A aremechanically engaged.

According to the present embodiment, since the fins 305 can be formedseparately, the CAN-like heat dissipating base 304 can be formed as ifdrink cans are formed, thereby improving productivity. Theirregularities 305B are provided so as to improve adhesive properties ofthe resin fins 305A and the CAN-like heat dissipating base 304, and thusreduction in reliability such as dropping can be prevented. As an areafor heat transfer of the resin fins 305A and the CAN-like heatdissipating base 304 can be increased, reduction in thermal resistanceof the power module 300 can be achieved, thereby allowing the powermodule and the power converter device to be reduced in size.

FIG. 13(a) is a sectional view of a third power module 300 according tothe present embodiment, FIG. 13(b) is a side view of the third powermodule 300.

The difference from the above embodiments lies in that the fins 305provided on the cooling surface outside the CAN-like heat dissipatingbase 304 are not formed of a homogeneous material at the same time whenthe CAN-like heat dissipating base 304 is formed but provided afterwardon the CAN-like heat dissipating base 304 by fixing the plate-like finbase 305C on which the plurality of fins 305 are formed in advance tothe outside the CAN-like heat dissipating base 304 with a metal contactmaterial such as a braze material or a resin adhesive material.

According to the present embodiment, since the fins 305 can be formedseparately, the CAN-like heat dissipating base 304 can be formed as ifdrink cans are formed, thereby improving productivity. In addition,since the fin base 305C may be formed of metal such as Cu, Al, AlSiC,Cu—C, or Al—C, produced by a method such as forging, or may be formed ofan organic material such as a high thermal conductivity resin, the fins305 can be shaped into a concentric pin shape, ellipse, or the like.Since this allows the surface area of the fins 305 to be increased, anarea for heat transfer can be increased, thereby achieving reduction inthermal resistance of the power module 300. As a result, the powermodule and the power converter device can be reduced in size.

FIG. 14(a) is a sectional view of a fourth power module 300 according tothe present embodiment, and FIG. 14(b) is a side view of the fourthpower module 300.

The difference from the above embodiments lies in that the fins 305provided on the cooling surface outside the CAN-like heat dissipatingbase 304 are straight fins 305D, and in that the fins are made of thesame material as that of the CAN-like heat dissipating base 304 andformed integrally with the CAN-like heat dissipating base 304.

According to the present embodiment, the fins 305 are configured to bestraight shapes so as to make production easy and reduce pressure lossthat occurs in the cooling flow path. This achieves reduction in thermalresistance of the power module 300, and thus the power module and thepower converter device can be reduced in size.

FIG. 15(a) is a sectional view of a fifth power module 300 according tothe present embodiment, and FIG. 15(b) is a side view of the fifth powermodule 300.

The difference from the above embodiments lies in that the layout of thepin shape fins 305 provided on the cooling surface outside the CAN-likeheat dissipating base 304 are provided with a density variation, i.e.,fins 305 far from the power semiconductor are arranged at smallintervals and fins 305 in the vicinity of the power semiconductor arearranged at large intervals so as to increase the flow rate of thecooling medium flowing through the fins 305 positioned in the vicinityof the power semiconductor.

According to the present embodiment, since the flow rate of the coolingmedium flowing through the fins 305 in the vicinity of the powersemiconductor can be increased, the heat transfer rate in the vicinityof the power semiconductor can be increased. This achieves reduction inthermal resistance of the cooling medium and the power semiconductor,and thus the power module and the power converter device can be reducedin size.

FIG. 16(a) is a sectional view of a sixth power module 300 according tothe present embodiment, and FIG. 16(b) is a side view of the sixth powermodule 300.

The difference from the above embodiments lies in that the layout of thepin shape fins 305 provided on the cooling surface outside the CAN-likeheat dissipating base 304 are provided with a density variation, i.e.,fins 305 far from the power semiconductor are arranged at smallintervals and fins 305 in the vicinity of the power semiconductor arearranged at large intervals so as to increase the flow rate of thecooling medium flowing through the fins 305 positioned in the vicinityof the power semiconductor, and in addition, the fins 305 in thevicinity of the power semiconductor are shaped into ellipse-like, i.e.,elliptic fins 305E.

According to the present embodiment, since the flow rate of the coolingmedium flowing through the fins 305 in the vicinity of the powersemiconductor can be increased, the heat transfer rate in the vicinityof the power semiconductor can be increased. In addition, the fins 305in the vicinity of the power semiconductor are shaped into ellipse-like,and thus the surface area of the fins 305 are increased and the heattransfer rate can be increased. This achieves reduction in thermalresistance of the cooling medium and the power semiconductor, and thusthe power module and the power converter device can be reduced in size.

FIG. 17 is a sectional view showing the seal section of the power module300 and the cooling jacket 19A according to the present embodiment.

In FIG. 17, the cooling jacket 19A is formed integrally with the housing12 across the middle portion of the housing peripheral wall 12W, and theopening 400 is provided on the upper surface of the cooling jacket 19Aand the opening 404 of the cooling water path is provided on the lowersurface thereof. The power module mounting surface 410S is provided onthe periphery of the opening 400. An engagement section 420A forengagement with the lower cooling water path cover 420, is provided onthe periphery of the opening 404 and sealed with the liquid sealmaterial 800. The threaded holes 412 are screw holes for fixing to thecooling jacket 19A the module fixture 304C for pressing a flange 300B ofthe power module 300 to the mounting surface 410S. Since the pluralityof power modules 300 can be pressed to the cooling jacket 19A with themodule fixture 304C, the liquid seal material applied in advance betweenthe mounting surface 410S and the flange 300B of the power module 300 iscrushed and pressed, thereby inhibiting the cooling medium from leakingthrough between the mounting surface 410S and the power module 300. Thenumber of screws that press and fix the power module 300 to the coolingjacket can be reduced, and hence assemblability can be improved. Theflange 300B of the power module 300 is tilted to form a taper, so thatthe flange 300B can be reduced in width while maintaining the sealedarea. As a result, the cooling jacket 19A can be reduced in size and theflange 300B of the CAN-like heat dissipating base 304 of the powermodule can be reduced in size, the cooling jacket 19A, the housing 12,and the power module 300 can be reduced in size, thereby contributinggreatly to reduction in size of the power converter device 200. Thepower semiconductors built in to the power module 300 can be cooled fromthe both sides with the divided cooling water, thereby having anadvantage of reduction in thermal resistance. It is to be noted that arubber O-ring or the like have a similar effect to the liquid sealmaterial 800.

FIG. 18 is a sectional view showing the connection structure of aninput/output terminal of the power module 300 according to the presentembodiment.

In FIG. 18, the through hole 406 is formed in parallel to each of thepower modules 300 on the dividing wall portion of the cooling water flowpath 19 going back and forth in S shape. The capacitor module 500 isdisposed across the cooling water flow path 19 with respect to the powermodule 300, and the power module 300 and the capacitor module 500 canelectrically contact through the through hole 406. The positiveconductor plate 507 of the capacitor module 500 and the negativeconductor plate 505 of the capacitor module 500 are arranged through thethrough hole 406 of the vicinity of the power module 300. Each of theelectrical wiring boards 334 extending from the power module 300 isarranged in close proximity to the positive electrode-side conductorplate 507, the negative electrode-side conductor plate 505, and anoutput wiring 705. A braze material 706 is disposed in advance on eachof the electrical wiring boards 334 or on a part of the positiveelectrode-side conductor plate 507, the negative electrode-sideconductor plate 505, and the output wiring 705. Through the disposedbraze material 706, each of the electrical wiring boards 334 is placedopposite to the positive electrode-side conductor plate 507 and thenegative electrode-side conductor plate 505, and opposite to the outputwiring 705. An electrical current is caused to flow through between eachof the electrical wiring boards 334 and the positive electrode-sideconductor plate 507, the negative electrode-side conductor plate 505 andthe output wiring 705 via the braze material so as to heat the brazematerial 706, each of the electrical wiring boards 334, the positiveelectrode-side conductor plate 507, the negative electrode-sideconductor plate 505 and the output wiring 705. As a result, the brazematerial 706 is molten so as to connect each of the electrical wiringboards 334 with the positive electrode-side conductor plate 507, thenegative electrode-side conductor plate 505, and the output wiring 705.

According to the present embodiment, since the power wiring can beelectrically connected without using a fixing area for a bolt or thelike, the electric power wiring area can be reduced in size, and thusreduction in size of the power converter device can be achieved. As nobolt is used, the length of time for assembly can be reduced, andassemblability can be improved, thereby contributing to reduction incost.

FIG. 19 is a sectional view showing the connection structure of theinput/output terminal of the power module 300 according to the presentembodiment.

In FIG. 19, the through hole 406 is formed in parallel to each of thepower modules 300 on the dividing wall portion of the cooling water flowpath 19 going back and forth in S shape. The capacitor module 500 isdisposed across the cooling water flow path 19 with respect to the powermodule 300, and the power module 300 and the capacitor module 500 canelectrically contact through the through hole 406. The positiveconductor plate 507 of the capacitor module 500 and the negativeconductor plate 505 of the capacitor module 500 are arranged through thethrough hole 406 in the vicinity of the power module 300. Each of theelectrical wiring boards 334 extending from the power module 300 isarranged in close proximity to the positive electrode-side conductorplate 507, the negative electrode-side conductor plate 505, and anoutput wiring 705. Pressure is applied to each of the electrical wiringboards 334 or to part of the positive electrode-side conductor plate507, the negative electrode-side conductor plate 505, and the outputwiring 705, and each of the conductor plates is fixed by arc welding,micro TIG welding, laser welding, or the like at a specific connectionpoint, so as to constitute an electrical connection point 707.

According to the present embodiment, since the power wiring can beelectrically connected without using a fixing area for a bolt or thelike, the electric power wiring area can be reduced in size, and thusreduction in size of the power converter device can be achieved. As nobolt is used, the length of time for assembly can be reduced, andassemblability can be improved, thereby contributing to reduction incost.

FIG. 20 is a sectional view showing the electric power wiring structureconnected with the input/output terminal of the power module 300according to the present embodiment.

In FIG. 20, the through hole 406 is formed in parallel to each of thepower modules 300 on the dividing wall portion of the cooling water flowpath 19 going back and forth in S shape. The capacitor module 500 isdisposed across the cooling water flow path 19 with respect to the powermodule 300, and the power module 300 and the capacitor module 500 canelectrically contact through the through hole 406. There are arrangedthe negative electrode-side conductor plate 704 connected with thepositive conductor plate 507 of the capacitor module 500 and thepositive electrode-side conductor plate 702 connected with the negativeconductor plate 505 of the capacitor module 500 through the through hole406 provided in the vicinity of the power module 300. An electric powerwiring unit 701, which is constituted by laminating the electric powerwiring, which electrically connects each of the electrical wiring boards334 of the power module 300 with the positive electrode-side conductorplate 702 and the negative electrode-side conductor plate 704, and theoutput wiring 705 through a resin, is placed above the electrical wiringboards 334 of the power module 300. Each of the conductor plates isfixed by arc welding, micro TIG welding, laser welding, or the like at aspecific connection point, so as to constitute the electrical connectionpoint 707. In addition, a pressure fixture 700A that fixes the powermodule 300 to the cooling jacket 19A is integrated with the electricpower wiring unit 701 so that the power module 300 can be pressed andfixed in the cooling water path 19. Since slag is produced in arcwelding or the like, the power module 300 may be attached and wired withthe electric power wiring unit 701 before inserted into the housing 12to assemble the inverter device 200.

According to the present embodiment, as the electric power wirings areintegrated by laminated with a resin so that the heat capacity in thevicinity of the welded part is increased, temperature rise in the powermodule 300 due to temperature rise during welding can be reduced as muchas possible. In addition, no temperature rise occurs in the power module300 even if the distance from the welding point to the power module 300is reduced. Alignment of the welding point is performed using areference point 12A prepared in the housing 12, positions of theelectric power wiring unit and the power module 300 can be fixed, andthus misalignment during welding can be reduced, thereby allowing ahighly reliable electrical connection point to be formed. A protrudingportion that protrudes from a position opposite to the flange of thepower module 300 is formed in the cooling jacket 19A at the referencepoint 12A. The protruding portion protrudes from the cooling jacket 19Athrough a through hole formed on the flange of the power module 300, andthe tip section of the protruding portion reaches the pressure fixture700A. Since the tip of the protruding portion is fixed with the pressurefixture 700A, an insulation with the positive electrode-side conductorplate 702 is secured.

Here, a structure in which the insulation sheet 7000 is sandwichedbetween the positive conductor plate 702 and the negative conductorplate 704 may be adopted. This allows the distance between the conductorplates to be reduced and the conductor components can be reduced insize.

FIG. 21 is a sectional view showing the input/output terminal and thecapacitor structure of the power module 300 according to the presentembodiment.

In FIG. 21, each of the power modules 300 is placed at a predeterminedposition in the cooling water flow path 19 going back and forth in Sshape. The electric power wiring unit 701 connected with the electricalwiring board 334 of the power module 300 is disposed above the powermodule 300, and the capacitor 514 is disposed between the electric powerwiring unit 701 and the cooling water flow path 19. A connection sectionbetween the capacitor 514 and the electrical wiring boards 334 isprovided between the electric power wiring unit 701 and the coolingwater flow path 19, and drawing sections 314B and 316B engaged with anelectrical connection terminal of the capacitor 514 are formed on theelectrical wiring boards 334. The drawing sections 314B and 316B andeach of the electrical wiring boards 334 of the power module 300 arefixed by arc welding, micro TIG welding, laser welding, or the like at apredetermined connection point, so as to constitute the electricalconnection point 707. The pressure fixture 700A that fixes the powermodule 300 to the cooling jacket 19A is integrated with the electricpower wiring unit 701, so that the power module 300 can be pressed andfixed to the cooling water path 19. Since slag is produced in arcwelding or the like, the power module 300 and the capacitors 514 and 500may be attached and wired to the electric power wiring unit 701 beforeinserted into the housing 12 to assemble the inverter device 200.

According to the present embodiment, the capacitor 514 is disposedbetween the electric power wiring unit and the cooling water flow path19 so that the wiring distance between the power module 300 and thecapacitor 514 can be reduced significantly. This allows the wiringinductance to be reduced, the surge voltage generated upon switching thepower semiconductors to be reduced, and, in addition, switching loss andnoise generation in the power semiconductors to be reduced. As a result,a power module can be reduced in size and a small-sized, highly-reliablepower converter device can be achieved.

FIG. 22 is a sectional view showing the input/output terminal and thecapacitor structure of the power module 300 according to the presentembodiment.

In FIG. 22, each of the power modules 300 is placed at a predeterminedposition in the cooling water flow path 19 going back and forth in Sshape. The electric power wiring unit 701 connected with the electricalwiring boards 334 of the power module 300 is disposed above the powermodule 300, and the capacitor 514 is disposed between the electric powerwiring unit 701 and the cooling water flow path 19. The embodiment shownin FIG. 22 has a structure in which the electric power wiring to beconnected with the negative electrode and the positive electrode of thepower module 300, which is built in to the electric power wiring unit701, and the electrical connection terminal of the capacitor 514 areconnected so as to integrate the capacitor 514 with the electric powerwiring unit 701. Each of the electric power wiring is fixed by arcwelding, micro TIG welding, laser welding, or the like at a specificconnection point, so as to constitute the electrical connection point707. In addition, the pressure fixture 700A that fixes the power module300 to the cooling jacket 19A is integrated with the electric powerwiring unit 701, so that the power module 300 can be pressed and fixedto the cooling water path 19. In addition, since slag is produced in arcwelding or the like, the power module 300 and the capacitor 514 may beattached and wired to the electric power wiring unit 701 before insertedinto the housing 12 to assemble the inverter device 200.

According to the present embodiment, the capacitor 514 is integratedwith the electric power wiring unit so that the wiring distance betweenthe power module 300 and the capacitor 514 can be reduced significantly.This allows the wiring inductance to be reduced, the surge voltagegenerated upon switching the power semiconductors to be reduced, and, inaddition, switching loss and noise generation in the powersemiconductors to be reduced. As a result, a power module can be reducedin size and a small-sized, highly-reliable power converter unit can beachieved.

FIG. 23 is a sectional view illustrating the fixation method and thecapacitor structure of the power module 300 according to the presentembodiment.

In FIG. 23, each of the power modules 300 is arranged at a predeterminedposition in the cooling water path 19 going back and forth in S shape,and the module fixture 304C that applies pressure to the power moduleand fixes the power module 300 to the cooling water path 19 is disposedabove the flange 300B of the power module 300. Protrusions 304B areprovided on the module fixture 304C so that the module fixture haspoint-contact with the flange 300B of the power module 300, and theprotrusions 304B press the upper surface of the flange 300B. For thisreason, the pressure applied to the flange 300B is uniformly distributedto the cooling jacket 19A to equally crush the liquid seal 800, and thusunevenness of pressure force due to deformation of the module fixture304C can be reduced.

The electric power wiring unit 701 connected with the electrical wiringboards 334 of the power module 300 is disposed above the power module300. The cooling jacket 19A is provided with openings in parallel withthe cooling water path 19, and the capacitor 514 which is disposedpartially in the electric power wiring unit 701 can be housed in theopening so as to cool the capacitor 514 with the cooling water directlyor through the inner wall of the cooling jacket 19A. The electric powerwiring connected with the negative 1.5 electrode and the positiveelectrode of the power module 300 and the electrical connectionterminals of the capacitor 514 are connected, and the capacitor 514 isintegrated with the electric power wiring unit 701. Each of the electricpower wiring is fixed by arc welding, micro TIG welding, laser welding,or the like at a predetermined connection point, so as to constitute theelectrical connection point 707. Since slag is produced in arc weldingor the like, the power module 300 and the capacitor 514 are attached tothe electric power wiring unit 701 and wiring is completed beforeinserted into the housing 12 to assemble the inverter device 200.

According to the present embodiment, the capacitor 514 is integratedwith the electric power wiring unit 701 so that the power module 300 andthe capacitor 514 can be efficiently cooled. In addition, since thewiring distance for connecting each unit can be reduced, the wiringinductance can be reduced, and the acceptable value of the ripplecurrent at the capacitor 514 can be improved. The surge voltagegenerated upon switching the power semiconductors can be reduced, andswitching loss and noise generation in the power semiconductors can bereduced. As a result, a power module can be reduced in size, a capacitorcan be reduced in size, and a small-sized, highly-reliable powerconverter unit can be achieved.

FIG. 24 is an illustration of the process flow showing the productionmethod of the CAN-like heat dissipating base 304 of the power module 300according to the present embodiment.

In FIG. 24, the first process (1) is a process for deforming a rawmaterial of the CAN-like heat dissipating base 304 into a substantiallyheat dissipating base shape, and the raw material is put into a CAN-likehole prepared in a mold 801. The raw material is deformable metal suchas aluminium or copper, or powdered metal. A protruding portion 800B forforming an opening that works as a housing of the power semiconductorand a groove 800A for forming a flange engaged with the cooling jacket19A are formed in a mold 800. By performing pressing to engage the mold800 and the mold 801, a primary forming CAN-like cooling member 803 isformed. Next, the second process (2) is a process in which fins areformed in the primary forming CAN-like cooling member 803 produced inthe first process. Fin forming dies 802A and 802B are provided with aplurality of holes 804 through which pin-like fins are formed. Byinserting the primary forming CAN-like cooling member 803 into a mold inthe same shape as the mold 801 and pressing the fin forming dies 802Aand 802B placed on the both sides, the fins 305 of the CAN-like heatdissipating base 304 and the thin-walled outer circumference curvedportion 304A are formed and a remaining material protrudes from betweenthe fin forming dies 802A and 802B. Lastly, height of the formed fins305 and the protruding remaining material are cut and removed, and thusthe CAN-like heat dissipating base 304 is completed.

After completion, the surface of the CAN-like heat dissipating base 304may be washed or a process to reduce surface roughness may be performedby chemical polishing or the like.

According to the present embodiment, the CAN-like heat dissipating base304, which has the exterior wall formed of the same material that isseamless with both of the heat dissipating bases so as to cover theperiphery of the heat dissipating bases facing each other, the openingprepared on the part of the exterior wall, and the power semiconductorshoused in the opening, can be produced with ease in the two pressingprocesses. With this method, reliability and strength during deformationdue to metal corrosion, cooling water pressure, and the like can bemaintained over a long period of time, compared to a CAN-like heatdissipating base having a seam of welding or the like. In addition,deformation due to thermal stress generated during welding and itsresidual stress can be prevented, and thus, uneven thickness, rip, andthe like of the built-in power semiconductors and the insulation sheet334A, which is an adhesive insulation layer, can be prevented. Moreover,the growth in size of fins due to flange for welding or the like can beprevented, so that the highly-reliable, small-sized double-sided coolingthe power module 300 can be configured, thereby achieving a small-sized,highly-reliable power converter device.

It is to be noted that the end portion of the outer circumference curvedportion 304A, which works as a connecting member, may be formed in atapered shape or may be configured so as to have curvature of apredetermined value or more.

The present application is based upon Japanese Patent Application No.2008-280682 (filed on Oct. 31, 2008), and hereby incorporates thecontents thereof by reference.

The invention claimed is:
 1. A power converter device, comprising: afirst double-sided electrode module that includes a DC positiveelectrode wiring board that is connected to a first power semiconductordevice via a metal joint member; a second double-sided electrode modulethat includes a AC terminal and a DC negative electrode wiring boardthat is connected to a second power semiconductor device via a metaljoint member; a heat dissipating base that sandwiches heat dissipationsurfaces of the first double-sided electrode module and the seconddouble-sided electrode module via an insulation layer; a jacket to whichthe heat dissipating base is fixed; a capacitor module that constitutesa smoothing circuit for inhibiting fluctuation in DC voltage; a positiveelectrode conductor plate and a negative electrode conductor plate thattransmit electric power between the capacitor module and the firstdouble-sided electrode module and the second double-sided electrodemodule; and an output wiring that transmits alternating current from thesecond double-sided electrode module, wherein the positive electrodeconductor plate is connected to the DC positive electrode wiring board,the negative electrode conductor plate is connected to the DC negativeelectrode wiring board, the positive electrode conductor plate and thenegative electrode conductor plate are stacked one on top of another andintegrated together by a resin, and constitute an electric power wiringunit that fixes the output wiring to the resin, and the electric powerwiring unit is contacted with the jacket.
 2. The power converter deviceaccording to claim 1, wherein a space for housing the capacitor moduleis formed in the jacket, the capacitor module is arranged facing thefirst double-sided electrode module and second double-sided electrodemodule with the heat dissipating base sandwiched therebetween.
 3. Thepower converter device according to claim 1, wherein the electric powerwiring unit has a first region that includes the output wiring and asecond region that includes the positive electrode conductor plate andnegative electrode conductor plate without including the output wiring,and the second region is arranged on an opposite side of the firstregion relative to the DC positive electrode wiring board and the DCnegative electrode wiring board.
 4. The power converter device accordingto claim 1, further comprising: a capacitor side positive electrodeconductor plate and a capacitor side negative electrode conductor platethat protrude from the capacitor module, wherein, the positive electrodeconductor plate and the negative electrode conductor plate integratedtogether are arranged on an opposite side of the capacitor modulerelative to the heat dissipating base, and the capacitor side positiveelectrode conductor plate and the capacitor side negative electrodeconductor plate extend through the side of the heat dissipating base andare respectively connected to the positive electrode conductor plate andthe negative electrode conductor plate.
 5. The power converter deviceaccording to claim 4, wherein the capacitor side positive electrodeconductor plate and the capacitor side negative electrode conductorplate are respectively welded to the positive electrode conductor plateand the negative electrode conductor plate.
 6. The power converterdevice according to claim 1, further comprising: a fixture that covers aplurality of the double-sided electrode modules arranging along adirection so that the heat dissipating surfaces of the double-sidedelectrode modules are facing to each other, wherein, the fixture isformed integrally with the electric power wiring unit.
 7. The powerconverter device according to claim 6, wherein the fixture has apedestal for fixing a control circuit board or a metal base board. 8.The power converter device according to claim 6, wherein the fixture hasa fixing part for fixing the fixture with the jacket.